- The integrated module
- A 4 × 4 module array with their full interface, under software control of input and output. Chosen as the smallest unit that exercises the whole architecture end to end, for engineering and manufacturing tractability rather than as a limit. Modules interconnect and pass energy to adjacent modules.
- Testing now
- The manifold proof. The geometry can be set, reconfigured while the module is running, and observed. The module is designed to scale rather than to demonstrate, and the path to custom arrays optimised for partners’ solutions runs through it.
- Array size
- Array dimensions are not fixed by the architecture. Arrays are modified and built to the configuration that best fits the implementation, so the size follows the workload rather than the other way round. Configurations optimised with specific memristor types for partners’ requirements are the commercial target this programme builds towards: they are not fabricated today, and the module described above is what exists.
- The device platform
- Nine memristor families, and around twenty device types tested and reproducible across them: titanium-based devices, new IGZO formulations, organic and biologically derived materials among them. Each has its own profile of conductance range, switching, retention and operating envelope, which is what lets one architecture reach different environments without a redesign. Suitability for a specific environment is currently inferred from material properties rather than established by qualification testing.
- The interface electronics
- Built on established analogue parts in current production, chosen for energy conservation and signal handling rather than process modernity, so there is no obsolescence exposure. The way they are applied to a memristor array is proprietary.